Tin plating has applications in the electronics industry because of its ability to protect the base metal from oxidisation, therefore preserving solderability.
TPG have a number of processes available (either dull / matt or bright) to electroplate tin using jigs, barrel and selective / all over reel to reel plating.
Types | Plating Methods | Base Materials | Properties | Specifications | Density p(kg/m3) | Melting Point Degrees Cent. | Electrical Resistivity (10-8 Ωm) at 0°C (273.2°K) |
---|---|---|---|---|---|---|---|
Bright, Dull | Jig/Vat/Rack, Barrel, Reel to Reel (all over, selective) | Copper Alloys, Steel, Aluminium | Ductile, Conductive, Corrosion Resistance | DEF 03-08, BS 1872, MIL-T-10727 replaced by ASTM B545 |
7285 | 232 | 11.5 |